EUV Lithography

Extreme ultraviolet (EUV) lithography is currently one of the most advanced optical techniques used in semiconductor fabrication. It involves using high-powered lasers to turn molten tin droplets into plasma and directing the emitted photons into a reflective semiconductor pattern. The reflected light then prints the pattern onto the semiconductor wafer. 

Current technologies operate with tin within the 13.5nm with a 2% bandwidth spectrum and have achieved 6% conversion efficiency. The Laboratory for Plasma Soft X-Ray Light Sources and Diagnostics is working to better understand the properties of tin plasma.

Non-Invasive Picosecond Electric Field Measurements

Ultrafast ionization thermalization and constriction in nanosecond repetitively pulsed discharges